Capabilities

THE CAPABILITIES OF AQC

At AQC, we base our Technological Roadmap on each of our customer’s individual and specific needs and requirements. “If you need it, AQC will make it.” From a simple single or double layer board, to a more complex board with a high layer count or special material requirements, AQC will meet your needs

AQC CAPABILITIES INCLUDE:

  • Quick turn facilities for each technology level

  • Single to multilayer PCBs, 80+ layers

  • Flex-rigid and Flex Boards, 28+ layers

  • RF and microwave technology

  • Blind / Burried HDI Boards, copper filled

  • Heavy copper layers Boards

  • Metal substrate (core) Boards

  • Ultra-Thin Boards, stretchable circuits

  • Board finishes*

AQC PRINCIPLE... WHO REFUSES THE SMALL IS NOT WORTHY THE LARGE.

BOARD FINISHES, AMONG OTHER THING:

HAL, HAL lead free, NiAu, OSP
Full Hard gold (Ni 5Um, min. 1.25 Um Au)
Immersion Tin and Silver
ENEPIG, Carbon, etc.