The increasing use of OR fluxes in electronics assembly is driven by several advantages: VOC-free formulations, excellent soldering performance, and improved cosmetic appearance.
However, these benefits can come with challenges. Certain OR fluxes may create compatibility issues with solder masks, resulting in effects such as blistering or whitening.
Fluxes are classified according to IPC-J-STD-004, while solder mask generally comply with IPC-SM-840 chemical resistance requirements. The latest revision, IPC-SM-840E, dates back to 2010 — highlighting the challenge of keeping standards aligned with rapidly evolving materials and processes.
According to IPC guidelines, the assembler remains responsible for validating compatibility between the selected flux system and solder mask. Since technology developments move faster than standardization, the electronics industry must proactively manage these risks.
Not all OR fluxes will create compatibility issues, but careful qualification and evaluation across multiple solder mask types is essential.
Another important factor is the large variety of solder mask suppliers and formulations available today. This makes it critical to work with qualified PCB suppliers only. Once a product is qualified, production should remain at the same factory using the same solder mask type. Any change in factory or solder mask should require formal approval from the end user.
If compatibility issues persist, switching to an RE or RO flux system may be a valid solution.
AQC guarantees that the qualified solder mask type and production location will not be changed without official approval from the end user. In addition, the AQC QA department ensures that all delivered products comply with applicable IPC standards and customer-specific requirements.
With more than 30 years of technological expertise in the field of PCB, AQC b.v. provides its customers with support at the highest possible level.
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