• HDI pcb’s with staggered Via and Stacked Via
  • Via in pad technology
  • Placing different high pin-count BGA’s
  • Maximization of wiring capacity
  • Size/weight reduction
  • High reliability
  • Future proof – component market leading

High density interconnect (HDI) boards primarily adopt the micro-blind/burried hole technology to make PCBs with higher density circuits.

The largest difference between a HDI and a traditional PCB is the hole formation method.
HDI technology adopts the non-mechanical drilling method that primarily uses laser drills. Also, different ways of hole filling and stacking are adopted during the production process.