HDI – HIGH DENSITY INTERCONNECT
- HDI pcb’s with staggered Via and Stacked Via
- Via in pad technology
- Placing different high pin-count BGA’s
- Maximization of wiring capacity
- Size/weight reduction
- High reliability
- Future proof – component market leading
High density interconnect (HDI) boards primarily adopt the micro-blind/burried hole technology to make PCBs with higher density circuits.
The largest difference between a HDI and a traditional PCB is the hole formation method.
HDI technology adopts the non-mechanical drilling method that primarily uses laser drills. Also, different ways of hole filling and stacking are adopted during the production process.